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High Performance Solder Paste Inspection Machine For LED Of Fine Spacing L10

Categories Solder Paste Inspection Machine
Brand Name: ML
Model Number: L10
Certification: CE
Place of Origin: CHINA
MOQ: 1 unit
Price: Negotiation
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 10 unit / month
Delivery Time: 20 work days
Packaging Details: M:1000x1000x1525mm;800KG L:1000x1130x1525mm;825KG
Maximum Loading PCB Size: M:X330xY250mm L:X510xY505mm
Thickness of the PCB: 0.4-7mm
Smallest Measuring Size: Rectangle:150um;Round:200um
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    • Product Details
    • Company Profile

    High Performance Solder Paste Inspection Machine For LED Of Fine Spacing L10

    Products Description and Specifications of SPI special use for LED of fine spacing:

    1. Programmable phase modulation profilermetry (PSLM PMP): Sinic-Tek patents, its unique programmable grating structure can use the software to set period of the grating; canceled the mechanical drive and transmission parts, greatly improving the accuracy of the equipment and scope of application, avoiding mechanical wear and maintenance costs and achieving 100% precision 3D measurement towards the printed solder paste in SMT production line.
    2. Sinic-Tek patent together with structured light technology solve problem of shadow interference in 3D solder Paste Inspection. Combined with RG-dimensional light source, it can perfect handle high-contrast substrates such as black substrate, ceramic substrate and so on. Using red, blue and green light, it can provide colored 2D image;
    3. High resolution image processing system: Ultra frames four million pixels industry CCD camera, with high-end camera, supports the fast and stable detection of 01005 solder paste. While providing 10um, 15um, 18um, 20um etc. a variety of different detection accuracy, to meet the customer's requirements as product diversity and inspection speed.
    4. Quick Gerber import and programming software, can achieve 5 minutes programming, which is the fastest in the industry; artificial Teach function is convenient for programming and inspection even in the absence of Gerber data.
    5. Z-axis real-time dynamic profiling: the features of PSLM provides a real-time dynamic tracking for PCB warpage change , and perfect solve the problem of flexible circuit boards and PCB warpage.
    6. Powerful process statistical analysis (SPC): Real-time SPC information display, complete and various SPC tool that allows the users to real-time monitor problems in the production , reduce the defects caused by bad solder paste printing. It will support the operator with a strong quality control , allow the users to be be clear at a glance.

    7.Equipment Repeatability << 10%.

    Equipment Hardware and Software Configuration:


    ModelL10
    Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly
    known as moire fringe technology)
    MeasurementsVolume,acreage,height, XYoffset, shape
    Detection of Non - Performing TypesMissing,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface
    contamination
    Camera Pixel4M
    Lens TypesTelecentric lens
    Lens Resolution15um(13/10um as option)
    FOV Size30*30mm
    Lens TypesTelecentric lens
    AccuracyXY Resolution):1um;Height:0.37um
    RepeatabilityHeight:<1um (4 Sigma);volume/acreage:<1%(4 Sigma)
    Gage R&R<10%
    FOV Speed0.40s/FOV
    Quantity of Inspection HeadSingle Head (Twin-Heads,Tri-Heads as optipon)
    Red Green Blue/RGB Three Colas
    Option Light Source
    Standard configuration
    Mark-point Detection Time0.5 sec/piece
    Compensation Plate Bending
    of Real-time Lift in Z-axis
    Standard configuration
    Maximun Meauring Height±550um ( ±1200um as option)
    Maximun Measuring Height
    of PCB Warp
    ±5mm
    Minimum Pad Spacing100um ( pad height of 150um as the reference)
    Smallest Measuring SizeRectangle:150um;Round:200um
    Number of padsLess than 100000
    Maximum Loading PCB SizeM:X330xY250mm
    L:X510xY505mm
    Thickness of the PCB0.4-7mm
    Height Limitations of the Partsup:40mm down:40mm
    Board Edge Distance3mm , (multifunctional clip edge as option)
    Flixble or Fixed Orbit SettingFront orbit (back orbit as option)
    PCB Transfer DirectionLeft to right or right to left
    Orbit Width AdjustmentManual and automatic
    SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability
    Data;SPI Daily/Weekly/Monthly Reports
    Gerber & CAD Data ImputSupport Gerber format(274x,274d);Manual Teach model ;
    CAD X/Y,Part No.,Package Type imput
    Computer typeDELL Image Workstation
    CPUIntel 8-core
    RAM24G
    GPU2G discrete graphics
    Hard disk1T
    DVD+RWStandard configuration
    Operating SystemWindows 7 Professional ( 64 bit)
    Equipment Diemension
    and Weight
    M:1000x1000x1525mm;800KG
    L:1000x1130x1525mm;825KG
    Power220V,10A
    Air Pressure4~6Bar
    Power (Start / nornmal)Start:2.5kw / Normal operation:2kw
    Loading Requirements
    of the Floor
    500kg/m²
    OptionsMultifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print closed-loop control, out-line programming software, maintenance was optionkstations, dynamic Mark point read function, coaxial Mark point camera ,UPS continuous power supply
    Quality High Performance Solder Paste Inspection Machine For LED Of Fine Spacing L10 for sale
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